There are two distinct developments in the client processor space for AMD—first, its Ryzen 7000X3D desktop processors have managed to retain gaming performance competitiveness against Intel's fastest 13th Gen Core "Raptor Lake" processors; and second, that its Ryzen 7045HX "Dragon Range" mobile processors are picking up interest in the enthusiast-segment notebook community, where its advanced 5 nm + 6 nm process is dealing damage to 13th Gen Core mobile processors in performance/Watt, and gaming performance. Can AMD dial things up a notch? Technically, yes.

It should technically be possible for AMD to build "Dragon Range" multi-chip modules using "Zen 4" + 3D Vertical Cache CCDs (CPU complex dies), much in the same way it did for the desktop product stack. Such a processor would either have one CCD with the 3DV cache for a CPU core-count of up to 8-core/16-thread; or a contraption similar to the desktop 7950X3D, wherein one of the CCDs has 3DV cache, while the other is a regular "Zen 4" CCD, for core-counts of up to 16-core/32-thread. But will AMD build such chips? A lot would depend on the volumes of L3Ds (the 6 nm dies with the 64 MB 3D Vertical cache memory that operates at 2.5 TB/s), the production of CCDs with 3DV cache; and whether AMD is able to achieve the right performance/Watt numbers against Intel's fastest 8P+16E "Raptor Lake" mobile processors.