Lin Jun-Cheng, a semiconductor industry veteran, has been at TSMC since 1999 and has worked developing TSMC's major chip packagings technologies such as CoWoS and InFO. Before leaving TSMC in 2017, he was ranked as Deputy Director of the R&D department, overseeing many advances and solutions that TSMC uses today. However, he worked as the CEO of Skytech semiconductor equipment company before joining Samsung. Today, we have information that Lin Jun-Cheng has entered Samsung as Vice President of the Advanced Packaging Business, resulting in a move ranked as a threat to TSMC and its packaging business. Given the track record of Mr. Lin, he brings expertise in creating new 3D stacking technologies that could jeopardize TSMC's position and establish Samsung as an outstanding competitor.

DigiTimes' interview with semiconductor industry analysts notes that the move of such a high-profile executive to Samsung could threaten TSMC's well-established business and allow the South Korean giant to compete even in the advanced chip packaging world. Notably, his work at Skytech was mainly about 2.5D and 3D chip integration, and during his tenure as a CEO, he helped the company secure over 100 patents. It is interesting to see what Samsung will develop in the future, as the company is reportedly poaching talent from various companies like Intel, Apple, and Qualcomm.