Intel Foundry Services is onboarding two new defense industrial base (DIB) customers, Boeing and Northrop Grumman, as part of phase two of the U.S. Department of Defense (DoD)'s Rapid Assured Microelectronics Prototypes - Commercial (RAMP-C) program. In phase two of the RAMP-C program, customers will use Intel 18A process technology and industry-standard electrical design and analysis tools and intellectual property (IP) to develop, tape-out and fabricate test chips in preparation for product design tape-outs.

"We are pleased to welcome Boeing and Northrop Grumman to the RAMP-C program. Boeing and Northrop Grumman will use their industry expertise to develop and support leading-edge semiconductor solutions using Intel 18A process technology for the success of vital DoD and national security systems. Together, we will continue to bolster the domestic semiconductor supply chain and ensure that the United States maintains leadership in process technology R&D, advanced manufacturing and microelectronics systems," said Kapil Wadhera, vice president of Intel Foundry Services and general manager of Foundry Solutions Business Group.