Micron Technology, Inc. (Nasdaq: MU), today unveiled the industry's first standard low-power compression attached memory module (LPCAMM2) available in capacities from 16 GB to 64 GB, which delivers higher performance, energy-efficiency, space savings and modularity for PCs. Sampling now with production in the first half of 2024, LPCAMM2 is the first disruptive new form factor for client PCs since the introduction of small outline dual inline memory modules (SODIMMs) in 1997. Micron's LPDDR5X DRAM incorporated into the innovative LPCAMM2 form factor will provide up to 61% lower power and up to 71% better performance for PCMark 10 essential workloads such as web browsing and video conferencing, along with a 64% space savings over SODIMM offerings.

As generative artificial intelligence (GAI) use cases proliferate to client PCs, performance of the memory subsystem becomes more critical. LPCAMM2 delivers the required performance to process AI workloads on PCs and provide the potential to scale to applications needing a high performance and low power solution in a compact and modular form factor, with the ability to upgrade low power DRAM for the first time, as customer needs evolve.