AMD Zen6 with RDNA5 iGPU, 2.5D interconnect

The Zen5 architecture is not even here yet, but the details on the successor as beginning to surface.

Two core architectures are currently being worked on by AMD: Zen5 “Nirvana” and Zen6 “Morpheus.” Those cores are expected to be a substantial upgrade for the Zen architecture family, either in terms of performance or the technology used for packaging.

The Zen5 architecture is set to debut this year under the Granite Ridge CPU and Strix Point APU series. The former is said to incorporate the same RDNA2 iGPU as Raphael, as both architectures are said to use the same IO Die where the GPU is located. The Strix Point, on the other hand, is an APU design with a powerful integrated GPU featuring Navi 3.5 (RDNA3.5) design.

The next in line, the Zen6 client architecture codenamed “ Medusa “, will be a major shift for AMD, as the company is now rumored to employ 2.5 interconnects instead of a traditional multi-die design. It would improve the bandwidth speed between chiplets.

According to Everest (@Olrak29_), the company is said to be planning RDNA5 iGPU for the Zen5 client CPUs. Presumably this means that one of the chiplets would feature a RDNA5 tile, which also means AMD would be skipping RDNA4.

AMD RDNA5 (Navi5) has not been discussed a lot yet, but it was mentioned in official Microsoft documents as a candidate for the next-gen console GPU.

Next-Gen Xbox, Source: Microsoft

As far as rumors are concerned, AMD Zen6 client architecture could be using a smaller process node (possibly a mix of 3nm and 2nm), and it should be expected no sooner than 2025/2026.

Source: Everest