PCB thermal coating can reduce DDR5 temperature by 10%

The company announced a new thermal coating technology for its DDR5 memory.

ADATA’s new DDR5 memory shipping with 8000 MT/s transfer speed or more will be using new cooling tech. The company will be applying ‘thermal coating technology’ to its overclocked RAM kits, which is said to reduce temperatures by 10%. The company claims that this means 8.5 °C lower temperature in real-world testing.

Therefore, XPG is leading the industry in applying PCB (printed circuit board) thermal coating technology to overclocked memory, effectively reducing temperatures by more than 10%. […] Real-world testing demonstrate a 8.5°C temperature reduction in overclocked DDR5 memory with PCB heat dissipating coating technology compared to standard overclocked memory and an enhanced heat dissipation efficiency of 10.8%.

— ADATA

The coating will serve as an additional heat dissipating area and will benefit in lower temperatures when used in combinations with heatsinks. ADATA is planning to use this technology for its fastest overclocked kits, featuring 8000 MT/s speeds and more.

ADATA has provided one image demonstrating the use of thermal coating on a memory kit that has no heatsinks. The company did not specify the speed at which the kit was running at:

Infrared thermal imaging cameras show temperatures with/without heat dissipating coating

According to the press release, the first memory kits with thermal coating will launch in the second quarter and there will be more releases as part of the LANCER NEON RGB and LANCER RGB series around Computex 2024. It seems like memory companies are preparing new products for release just before Intel releases its new LGA-1851 platform. This platform will only work with DDR5 technology.

Source: ADATA PR