NVIDIA RTX 5090 Founder’s Edition rumored to feature 16 GDDR7 memory modules in denser design

Please note that this post is tagged as a rumor .

NVIDIA RTX 5090 PCB rumors: dense memory layout, three PCBs for improved airflow

Chiphell leaker claims NVIDIA’s next-gen GPU may use non-standard PCB design.

The memory layout for the upcoming RTX 5090 graphics card will differ from that of the RTX 4090. The new flagship GPU, featuring the Blackwell GB202 GPU, is rumored to have a 512-bit memory bus. This will likely increase memory capacity, which would require more modules around the GPU.

The RTX 5090 is expected to support GDDR7 memory, arranged in a denser configuration than the current RTX 4090. The layout will shift from 3-4-1-4 to 4-5-2-5 (clockwise), allowing the board to support up to 16 memory modules. However, this does not mean that all modules must be used  nor does it confirm their capacities. However, if the RTX 5090 utilizes the same 2GB modules, it could potentially offer up to 32GB of memory.

A superimposed memory layout on RTX 4090 Founder Edition PCB would look like this:

A mockup of the GB202 Memory Layout, Source: VideoCardz

The rumor further alleges that the design will feature three PCBs. It’s unclear exactly what the leaker means by this, but it is worth noting that NVIDIA has previously experimented with non-standard PCB designs, such as for the unreleased RTX TITAN ADA GPU. In that case, the PCB was supposed to be placed parallel to the PCI slot, implying that the PCIe interface would be on a separate PCB.

Although the actual board was never pictured, the prototype cooler intended for this design has been extensively leaked. The leaks suggest that a quad-slot, triple-fan cooler would sit on top of this PCB configuration.

RTX TITAN ADA Prototype cooler, Source: Hayaka

NVIDIA is expected to unveil its RTX 50 series this year, possibly in the fourth quarter. Typically, leaks increase between June and August ahead of a new series launch. This uptick happens because NVIDIA is engaging with more partners during this period, some of whom are already working on prototype cooler manufacturing. These prototype coolers are often the subject of leaks.

Source: Chiphell