MaxSun lists Intel Z890, B860 and H810 motherboards
MaxSun, a Chinese manufacturer, has nearly 80 motherboards to the Eurasian Economic Commission (EEC). These include models designed for Intel’s upcoming Core Ultra 200 series, also known as Arrow Lake-S.
Intel is preparing at least three chipsets for the LGA-1851 motherboards: Z890 , B860 , and H810 . While previous leaks had only mentioned the Z890 and B860 chipsets, the EEC submission from MaxSun confirms the entry-level H810 chipset. This chipset will be featured in MaxSun’s Esport, Challenger, and Terminator brands.
MaxSun’s high-end iCraft series will only include motherboards with the Z890 and B860 chipsets. There is no mention of the AMD B850 iCraft series, although there are Terminator, Challenger and Esports models listed. However, the list also does include a B840M, which could either be a typo or an indication of a new chipset variant, possibly distinguishing between Extreme and non-Extreme series.
There is no trace of the AMD X870 series in the current filing, but historically, MaxSun has focused more on Intel chipsets, with a smaller range dedicated to AMD, so those may appear later.
| MAXSUN New Motherboards | |||
|---|---|---|---|
| INTEL Z890 | INTEL B860 | INTEL H810 | AMD B850/840 |
| MS-iCraft Z890 VERTEX MS-iCraft Z890 ARCTIC MS-iCraft Z890 PACIFIC MS-Terminator Z890-A MS-iCraft Z890ITX MS-ESPORT Z890M WIFI MS-Challenger Z890M WIFI | MS-iCraft B860M CROSS MS-Terminator B860M MS-Terminator B860M GKD MS-ESPORT B860M SNIPER WIFI MS-ESPORT B860M GANK WIFI MS-ESPORT B860M ACE WIFI MS-Challenger B860M-E MS-Challenger B860M-F MS-Challenger B860M MS-MILESTONE B860M MS-Challenger B860ITX MS-Challenger B860BKB MS-Terminator B860YTX | MS-ESPORT H810M GANK WIFI MS-Challenger H810M MS-Challenger H810M-K MS-Challenger H810M-F MS-Challenger H810M-D MS-Terminator B860ITX | MS-Terminator B850M WIFI MS-Esports B850M WIFI6 ICE MS-Terminator B850ITX WIFI MS-Challenger B850M WIFI ICE MS-Challenger B840M 2.5G |
MaxSun’s EEC filing lines up with similar leaks from MSI and Gigabyte , suggesting that at least three motherboard manufacturers have completed their planning and are likely in production ahead of the Core Ultra launch in Q4. There is also speculation that these manufacturers may showcase their next-gen Intel boards at Computex. Although this hasn’t been confirmed, the timing of the leaks hints at this possibly being the case.
VideoCardz has reached out to MaxSun for a comment on what the B840 chipset is supposed to be. It is very likely that the company will decline to comment, though, but we will keep you posted.
Source: EEC via @harukaze5719