TSMC kicks off chip production for Intel Lunar Lake

First Intel CPUs with 3nm node are expected in the next quarter.

According to DigiTimes, citing industry sources, production of 3nm chips has begun at TSMC for Intel’s next-gen client series, codenamed Lunar Lake. This product is officially launching next quarter (Intel has yet to confirm the exact date) and is the first by Intel to utilize TSMC nodes for all three chiplets in its disaggregated design (CPU tile and SoC tile with GPU). The Lunar Lake chips utilize TSMC N3B and TSMC N6 nodes.

Intel Lunar Lake is expected to launch as the Core Ultra 200V series and will be the first product to feature Lion Cove P-Cores and Skymont E-Cores. The same architectures will be used in the Core Ultra 200 “Arrow Lake-S” for desktops, expected to launch in the fourth quarter. The main differences, aside from their platform and power targets, are related to graphics capability.

Intel will start the conversion of the new and old NB platforms in the second half of the year as scheduled. It will launch the Lunar Lake and Arrow Lake series at the end of the third quarter and fourth quarter respectively. The biggest highlight is the first release of Compute Tile from TSMC. Finally, it has used the 3nm customized process technology that TSMC has deployed for a long time, and has recently begun production

— DigiTimes

Intel Lunar Lake ,Source: Intel

Intel Lunar Lake features Xe2-LPG graphics (a low-power variant of the Battlemage architecture), while Arrow Lake will use Xe-LPG (Alchemist), the same as the Core Ultra 100 “Meteor Lake”. Another important difference is that Lunar Lake uses system memory integrated on the package (MoP).

At Computex, Intel confirmed that Lunar Lake will be released in the third quarter, although no specific month was mentioned. The new architecture will be part of the Microsoft Copilot+PC platform, once certified.

Source: DigiTimes (paywall) via Wccftech , TechPowerUP