JEDEC sets LPDDR6 CAMM speed goal to 14.4 GT/s

Next-Gen Low-Power DDR6 memory gets official speed goal

Faster and needs less space than traditional module.

We’ve extensively discussed Compression Attached Memory Modules (CAMM) in recent weeks, largely due to the surge of interest from memory companies that showcased new solutions at Computex. Currently, there are limited systems capable of utilizing CAMM, but the fact that several companies have also demonstrated desktop motherboards featuring this type of memory could potentially lead to increased popularity.

It may be too late for LPDDR5/X modules to be launched for the current generation of Intel motherboards, as the company is now transitioning to a new socket. However, this could be an opportunity to explore with the next generation. As for the actual standard, LP5X is now reaching speeds of up to 7500 MT/s (ROG Ally X) or 8533 MT/s (Lunar Lake), and it’s too early to expect any products to feature LPDDR6.

LPDDR6 CAMM2, Source: JEDEC

The good news is that JEDEC is finally approaching the point where the full specs for this standard will also be confirmed. The speed of LPDDR6 is expected to be anywhere between 10667 MT/s to 14400 MT/s. Worth adding that there are LPDDR5X modules that already reach such speeds, as Samsung recently announced 10.7 Gbps modules for MediaTek SoC. But the goal for LPDDR6 is much higher.

JEDEC has announced that the CAMM modules for this standard are set to support maximum speed greater than 14.4 GT/s.:

As a follow-on to JEDEC’s JESD318 CAMM2 Memory Module standard, JC-45 is developing a next-generation CAMM module for LPDDR6 targeting a maximum speed greater than 14.4 GT/s. As planned, the module will also offer a 24-bit subchannel, a 48-bit channel and a connector array.

Data Rate of LPDDR memory (JEDEC)

  • LPDDR4 (2014) : 3200 MT/s
  • LPDDR4X (2017) : 4267 MT/s
  • LPDDR5 (2019): 6.400 MT/s
  • LPDDR5X (2021) : 8.533 MT/s
  • LPDDR6 (2025?) : 10.67 GT/s – 14.4 GT/s ⬅️

The CAMM modules are primarily designed for laptops, where their smaller footprint enables less space waste and retains upgradability. Otherwise, companies may be forced to choose between SODIMM modules or soldering memory directly to the motherboard, which eliminates the upgradability feature.

Source: JEDEC