LPDDR5X at 0.65mm for smartphones and mobile devices

Samsung has announced a new memory package which is extremely thin.

The new Low-Power DDR5 memory boasts not only the highest speeds but also large capacities and an ultra-thin package. The LPDDR5X memory is gradually replacing SODIMM DDR5 in laptop designs and is used in many of the fastest smartphones on the market.

According to Samsung, the latest LPDDR5X memory offers a 9% reduction in thickness compared to its predecessor and boasts a 21% improvement in heat resistance. It features a 4-stack structure and supports capacities of up to 12GB and 16GB per module. This memory is manufactured using a 12nm process.

LPDDR5X 0.65mm memory,Source: Samsung

Samsung notes that this memory will enable mobile device manufacturers to save space and improve airflow within their devices. This new memory features optimized PCBs (printed circuit boards) and advanced epoxy molding compounds. Samsung claims it’s as thin as a fingernail:

LPDDR5X 0.65mm memory,Source: Samsung

Furthermore, Samsung plans to develop LPDDR5X memory with 6-layer and 8-layer structures, which would enable capacities of up to 24GB or even 32GB per module. Such memory may find its ideal application in gaming handhelds that require high capacity without sacrificing space.

The LPDDR5X memory is now used by most Ryzen AI 300 “Strix Point” laptops and will also be adopted by Intel’s Core Ultra 200V “Lunar Lake” series, although the latter integrates the memory directly into the chip package.

Source: Samsung