Specifications of Intel's upcoming Core Ultra 200T and 200 non-K series of CPUs have been shared on X by data aggregator and leaker momomo_us . These CPUs are expected to arrive by CES 2025, in tandem with cheaper B860 and even H810 motherboard chipsets - making Arrow Lake accessible for budget-conscious consumers.
The list details 7 SKUs spread across the Ultra 9, Ultra 7, and Ultra 5 families - the Core Ultra 3 segment remains unaddressed. Intel launched the Core Ultra 200S unlocked (125W) processors last month and the performance has been disappointing , to say the least. As is tradition, Intel will launch budget variants of these processors with trimmed-down TDPs; the Core Ultra 200 non-K (65W) and Core Ultra 200T (35W) series. From the looks of it, this list might not be complete as a few CPUs are missing, but let's go over them nonetheless.
Starting with the Core Ultra 9 series: Intel is prepping a Core Ultra 9 285 with 24 cores and a base clock speed of 2.5 GHz. Its 285T counterpart on the other hand drops the base frequencies to 1.4 GHz due to its 35W TDP. The 20-core equipped Core Ultra 7 265 series sees a 100 MHz variance in clocks: 2.4 GHz for the 65W and 1.5 GHz for the 35W variant. Lastly, the Core Ultra 5 225 comes packed with 10 cores and clocks in at 3.3 GHz (65W), but seemingly lacks a 35W version which is why we can infer that this list is probably incomplete.
pic.twitter.com/sfRzc4QOlI November 11, 2024
For a quick sanity check, Benchlife shared specifications of the entire Arrow Lake lineup a while back - detailing a handful of unmentioned SKUs. In any case, despite the initial disappointment, Arrow Lake scales pretty well at lower power limits. The Core Ultra 9 285 (65W) was seen toe to toe against the unlocked i9-14900K in Geekbench a while back.
This means that the 35W 200T offerings will be the go-to for efficiency-oriented users and can demonstrate Arrow Lake's true potential. Sadly, this doesn't mean we'll see Arrow Lake in sub-10W mini PCs anytime soon, likely due to the high costs associated with its architecture and packaging technology.
