Cadence today announced a significant expansion of its portfolio of design IP optimized for Intel 18A and Intel 18A-P technologies and certification of Cadence digital and analog/custom design solutions for the latest Intel 18A process design kit (PDK). These advancements are being showcased today at Intel Foundry Direct Connect, underscoring Cadence's continued leadership in driving industry innovation for artificial intelligence and machine learning (AI/ML), high-performance computing (HPC) and advanced mobility applications through its strategic partnership with Intel Foundry.

Cadence has collaborated closely with Intel Foundry to design and optimize a comprehensive range of solutions that fully leverage the innovative features of the Intel 18A/18A-P nodes, including RibbonFET Gate-all-around transistors and PowerVia backside power delivery network. With this collaboration, joint customers can achieve exceptional power, performance and area (PPA) efficiencies, accelerating time to market for cutting-edge system-on-chip (SoC) designs.