"Full Die Shot" Analysis of Nintendo Switch 2 SoC Indicates Samsung 8 nm Production Origins

Late last month, Kurnal (@Kurnalsalts) shared a partial die shot of a supposed Nintendo Switch 2 chipset—this teaser image seemed to verify previous leaked claims about the forthcoming next-gen hybrid gaming console being powered by a custom NVIDIA "T239" SoC design. Two weeks after the fact, Kurnal has boasted about delivering an alleged "world's first Nintendo Switch 2 die shot." Their social media post included a couple of key specification data points: "Samsung 8N (8 nm), eight Cortex-A78C cores, (shared) 4 MB L2 cache, and 1536 CUDA/6TPC ' Ampere ' GPU." Another leaker—Geekerwan—said that they acquired a "Switch 2 motherboard" via Xianyu. This Chinese equivalent to eBay seems to be a veritable treasure trove of tech curiosities .

Earlier on in 2025, black market sellers were attempting to offload complete pre-launch Switch 2 packages for big money . As reported by VideoCardz, recent acquisitions only involved the securing of non-functional motherboard + SoC units—Kurnal disclosed a 1000 RMB (~$138 USD) price point. Digital Foundry's Richard Leadbetter is a very visible advocate of the Switch 2 chipset being based on an 8 nm Samsung node process. His personal belief was aimed at certain critics; these opposers predicted 5 nm manufacturing origins. Older leaks suggested a larger than expected die footprint—relative to Switch 1's internal setup; almost twice the size—leading to Leadbetter's conclusion. Comparison charts—produced by Kurnal and Geekerwan—propose an occupied area of 207 mm².
Read full story