Cooler Master is seated front-row center as Moore's Law tapers, and the need for advanced computing to have powerful cooling rises. The company showed off several innovations with its core business of cooling. We begin our tour of the Cooler Master booth with its new 3D Heat Pipe innovation. It may look simple and unorthodox, but CM says that this innovation took decades of innovation. Consider a U-shaped heatpipe from a typical tower-type CPU cooler, with its two ends passing through an aluminium fin-stack, and the central region making contact with the heat source (CPU).

Cooler Master innovated an arm of this heat pipe that pops out from the central region. This is easier said than done, as the pipe's inner channel needs to seamlessly connect with the rest of the heatpipe, and improper welding can cause metal extrusions that can clog the pipe. This is probably what took CM decades to figure out. The third arm of the heat pipe helps heat from the source spread more uniformly across the fin-stack. Cooler Master showcased its first tower-type coolers implementing 3D Heat Pipe tech, which we'll talk about in a bit.