AAEON's UP brand (stock code: 6579) today announced the release of two new developer boards based on the new Intel Core 3 processor platform (formerly Twin Lake), the UP TWL and UP TWLS. Those familiar with the UP 710S, released by the company late last year, will no doubt see a pattern emerging with the continuation of the slimmer, more advanced features hosted by the UP TWLS, while the developer community will note the more classic features of the UP TWL, including the return of the Raspberry Pi-compatible 40-pin GPIO that came to be a signature of AAEON's UP Brand portfolio.

Both boards offer a choice of the Intel Core 3 Processor N355, Intel Processor N250, or Intel Processor N150 CPU, the latest in Intel's processing technology focused on low power, energy-efficient performance. However, it is clear from the circuit board design of each that the boards are tailored for different deployment environments, with AAEON slimming down the height of the UP TWLS to just 25.13 mm by placing both its I/O and CPU on the same side.