XConn Technologies (XConn), the innovation leader in next-generation interconnect technology for high-performance computing and AI workloads, today announced that it will deliver a live, end-to-end PCIe Gen 6.2 and CXL 3.1 technology demonstration at the Future of Memory and Storage (FMS25) event, taking place August 5-7 at the Santa Clara Convention Center in booth #1245.

The demonstration will highlight how XConn's advanced switching solutions can enable next-generation systems with ultra-high bandwidth, extremely low latency, and seamless support for emerging memory and accelerator architectures. Attendees will see first-hand how Peripheral Component Interconnect Express (PCIe) Gen 6.2 and Compute Express Link (CXL) 3.1 technologies are driving the future of composable infrastructure and disaggregated computing.