Jarnistech, a PCB manufacturer specializing in high-end multilayer and specialty material boards, has recently launched its glass-based PCB solution. The solution has already been adopted in customer prototype validation projects, targeting applications that demand tight control over signal loss, thermal stability, and optical transparency.

As electronic systems evolve toward RF transmission, optoelectronic integration, and miniaturization, glass PCBs have emerged as a promising alternative to overcome material performance bottlenecks. Compared with traditional FR-4, glass substrates offer superior insertion loss characteristics, impedance consistency, thermal stability, and optical clarity.