Intel faces significant leadership challenges as a wave of veteran executives depart the company. Among the notable departures is Narahari Ramanuja, who dedicated 25 years to Intel, including over three years as Director of Advanced Packaging Technology Development, according to his LinkedIn profile . As reported by Oregon Live, Ramanuja will join Analog Devices as Managing Director and General Manager of their Beaverton FAB facility starting in late September. He joins Gang Duan, another Intel packaging expert who left for Samsung's components division, as reported by The Wall Street Journal, where Duan was recognized for his innovative contributions to semiconductor packaging technologies, particularly his work with glass materials.

The executive exodus occurs against a backdrop of massive workforce reductions and operational challenges for the chipmaker. According to Oregon Live, Intel has eliminated approximately 15,000 jobs in 2024, and 15,000 last month with Oregon bearing the brunt of these cuts—losing more than 5,400 positions over the past year alone. The departures extend beyond packaging specialists to include key manufacturing leadership, with Ann Kelleher , head of manufacturing, retiring in March, followed by Sanjay Natarajan, VP of factory technology research, in June, as noted by Oregon Live. Reuters reports that additional senior manufacturing executives, including corporate VPs Kaizad Mistry, Ryan Russell, and Gary Patton, are also set to retire. These changes come as Intel, despite recently agreeing to transfer a 10% stake to the U.S. government , continues pushing customers to adopt its Foveros advanced packaging technology over TSMC's CoWoS platform.