Resonac Corporation (President and CEO: Hidehito Takahashi, hereinafter "Resonac") today announced the establishment of "JOINT3," a co-creation evaluation framework formed by a consortium comprising Resonac and 26 other companies from Japan, the United States, Singapore, etc. These companies, all significant global leaders in the semiconductor supply chain, will jointly develop materials, equipment, and design tools optimized for panel-level organic interposers—semiconductor packaging technology that utilizes organic materials to create a bridge between different components on a circuit board—using a prototype production line for the manufacture of 515 x 510 mm panel-level organic interposers.

Resonac will establish an "Advanced Panel Level Interposer Center (APLIC)" as the main hub for this initiative within its Shimodate Plant (Minami-yuki) in Yuki City, in Japan's Ibaraki Prefecture. APLIC will house the prototype production line, which is scheduled to commence operations in 2026. Here, the Consortium will accelerate development efforts by delivering verification results that closely mirror real-world structures.