Huawei used its Connect 2025 event to unveil an ambitious hardware roadmap that pairs the company's first self-developed HBM memory with a new generation of Ascend AI accelerators, and the message was clear: Huawei will compete on scale rather than single-chip supremacy. While still lagging behind NVIDIA on per-chip performance, the system-scale solutions can be competitive. The company confirmed the Ascend 950 family for early 2026 in two variants. One model, labeled 950PR, is described with about 128 GB of in-house HBM and roughly 1.6 TB/s of bandwidth, while the 950DT increases memory to 144 GB and pushes bandwidth toward 4 TB/s. Huawei also sketched longer term plans for Ascend 960 and Ascend 970 devices arriving in 2027 and 2028, promising larger aggregate memory capacities, higher interconnect bandwidth, and wider support for FP8 precision formats.