PLP is an advanced, automated chip packaging and test process technology bringing increased manufacturing efficiency and reducing costs, and a key enabler for creating the next generation of smaller, more powerful, and cost-effective electronic devices. The large-area carrier in PLP (large rectangular shapes in place of circular wafers) enables higher manufacturing throughput, making it a more efficient solution for high-volume production. Building on its first-generation PLP line in operation in Malaysia and its global technology R&D network, ST plans to develop the next generations of its PLP technology to maintain its technological leadership and extend the use of PLP across many other ST products for automotive, industrial and consumer applications.
