Yesterday, Micron reported its fourth-quarter and full-year fiscal 2025 results , beating the consensus and providing interesting comments on its upcoming HBM technology. During the earnings call, Sanjay Mehrotra, CEO of Micron, confirmed that HBM4—the company's next-generation memory—will be available next year with several enhancements over the base HBM4 JEDEC specification . "Micron Technology's HBM4 12-high remains on track to support customer platform ramps, even as the performance requirements for HBM4 bandwidth and pin speeds have increased. We have recently shipped customer samples of our HBM4 with industry-leading bandwidth exceeding 2.8 TB/s and pin speeds over 11 Gbps." The JEDEC specification for HBM4 is 2 TB/s bandwidth and 8 Gb/s pin transfer across a 2048-bit interface. Micron is pushing this to 11 Gb/s, resulting in 40% higher bandwidth at 2.8 TB/s.

There is a simple reason why this is the case. Customers like NVIDIA are asking HBM makers to create a more performant HBM memory to keep up with the exponential growth that their compute dies are experiencing. To satisfy these requirements, Micron is moving beyond JEDEC specifications. "We believe Micron Technology's HBM4 outperforms all competing HBM4 products, delivering industry-leading performance as well as best-in-class power efficiency. Our proven 1-gamma DRAM, innovative and power-efficient HBM4 design, in-house advanced CMOS base die, and advanced packaging innovations are key differentiators enabling this best-in-class product," said Sanjay.