ASML is about to manufacture significantly more Low-NA EUV and High-NA EUV machines than it originally anticipated. As you may be aware, acquiring an EUV scanner is a year-long process, during which companies make commitments that can span several years to procure these tools. According to ASML, the company estimates that in 2027, based on current order information and demand, it will deliver 56 Low-NA EUV scanners. This includes five units for Intel, seven units for Samsung, and as many as 20 units for SK Hynix. According to South Korean media, SK Hynix plans to install 20 Low-NA EUV units in the next two years, all designed for HBM memory and advanced storage solutions.

For High-NA, ASML plans to deliver 10 High-NA EUV scanners, each costing around $380 million. Intel will add those two to its facilities manufacturing 14A node, and SK Hynix is expected to use two of those as well for its memory operations. Intel is betting big on its next-generation 14A node, adding additional EUV tools to its already existing High-NA portfolio. In the past, Intel disclosed that it processed over 30,000 wafers within a single quarter while achieving simplified manufacturing by cutting the required steps for a particular layer from 40 to fewer than 10, which naturally led to much faster cycle times. Similarly, Samsung has seen impressive results in its operations, documenting a 60% reduction in cycle time for one of its specific applications.