Synopsys, Inc., today announced TSMC has certified the Ansys portfolio of simulation and analysis solutions, enabling accurate final checks on chip designs targeted for TSMC's most advanced manufacturing processes including TSMC N3C, N3P, N2P, and A16. The companies also collaborated on an AI-assisted design flow for the TSMC-COUPE platform. Together, Synopsys and TSMC empower customers to effectively design chips for a range of applications including AI acceleration, high-speed communications, and advanced computing.

Multiphysics and AI-Driven Photonics Design Enablement
Synopsys continues to work with TSMC to expand multiphysics analysis flows for larger designs with hierarchical analysis methodology. The multiphysics flow includes Ansys RedHawk-SC, Ansys RedHawk-SC Electrothermal platform, and Synopsys 3DIC Compiler exploration-to-signoff platform to enable hierarchical thermal-aware timing analysis and voltage-aware timing analysis. This multiphysics approach can help customers accelerate the convergence of large 3DIC designs.