Qualcomm shows prototype Mini-PCs with AirJet coolers

Actually something interesting.

Source: AllroundPC/XDA

Qualcomm Snapdragon X2 Elite for Windows on ARM devices coming in 2026 is something that is yet to be tested and verified by reviewers, more so software than hardware reviewers maybe. The company made a lot of progress and thanks to Microsoft’s push into the ARM ecosystem, many large software companies now offer pure ARM-based software which requires no emulation.

However, Qualcomm is still relatively slow with updates for its graphics, and it is hardly something one would consider for gaming. The company decided to first introduce its X2 Snapdragon from Elite and Elite Extreme series, the most premium chips. As we noted in a previous story , this isn’t a good idea because these devices, in our opinion, are too expensive for what they deliver, although many reviewers who only check email on these systems will claim otherwise.

Source: HotHardware

One thing that stood out from an otherwise boring presentation was an interesting hardware concept device, two in fact. The company presented two Mini-PCs that are extremely slim and built without fans. They rely on AirJet technology from Frore Systems , which we covered some time ago. This kind of cooling is well-suited for low-power systems, but it is unlikely to ever scale into the high-end GPU market.

The first device is a disc-shaped mini-PC barely thicker than a stack of CDs, and it looks closer to a wireless charger than a desktop. Despite its size, it runs a full Snapdragon X2 Elite chip and powers an external monitor over USB-C/DisplayPort. The second concept is an all-in-one desktop with a modular design. The PC component sits inside the monitor base and can be detached for upgrades, a feature that makes it different from the standard mini-PCs mounted on displays by brands like Dell or Lenovo.

Source: PCMag

Both systems use Frore’s AirJet cooling, a solid-state thermal solution that replaces traditional fans with piezoelectric membranes that push air through tiny vents. It enables silent cooling in devices less than half an inch thick. Qualcomm noted that AirJet is just one option, and OEMs can also use fans or fully passive cooling depending on design goals.

Source: Qualcomm

These Mini-PCs are reference designs, meaning they might never reach the market in their current form.  But as we can see, their black variants were also shown in the official X2 Elite product renders above. Qualcomm confirmed it is working with several Taiwanese OEMs, so some variation of these ultra-thin systems could ship in 2026 alongside the first wave of Snapdragon X2 Elite devices.

Source: HotHardware , PCMag , AllroundPC , XDA