Texas Instruments is enhancing the next generation of digital lithography with the introduction of the DLP991UUV digital micromirror device (DMD), the company's highest resolution direct imaging solution to date. With 8.9 million pixels, sub-micron resolution capabilities and a data rate of 110 gigapixels per second, the device eliminates the need for expensive mask technology while delivering the scalability, cost-effectiveness and precision needed for increasingly complex packaging.

Why it matters
Maskless digital lithography machines - which project light for etching circuit designs on materials without a photomask or high-end stencil - are becoming increasingly popular for the manufacturing of advanced packaging. Advanced packaging combines multiple chips and technologies into a single package, enabling high-computing applications, such as data centers and 5G, to have systems that are smaller, faster, and more power-efficient.