Flex today announced the industry's first globally manufactured, fully integrated platform designed for gigawatt data centers supporting AI and HPC. By uniting power, cooling, compute, and Flex's global services into pre-engineered, modular reference designs for next-generation data centers, the new infrastructure platform enables operators to deploy infrastructure up to 30% faster, reduce execution risk, and scale reliably to meet the pace of AI demand. Flex will highlight the platform and new breakthrough products during the OCP Global Summit in booth B24.

"As AI adoption accelerates, data center operators must overcome rising power, heat, and scale challenges to deploy infrastructure at unprecedented speed," said Michael Hartung, president and chief commercial officer at Flex. "Flex delivers the industry's deepest hardware stack by integrating power, cooling, and compute with vertically integrated manufacturing at scale. Its open architecture provides the flexibility required for faster, more predictable deployments, enabling data center operators to keep up with AI demand."