Today at the Open Compute Project (OCP) Global Summit in San Jose, AMD (NASDAQ: AMD) showcased a static display of its "Helios," rack scale platform for the first time in public. Developed based on the new Open Rack Wide (ORW) specification, introduced by Meta, "Helios" extends the AMD open hardware philosophy from silicon to system to rack, representing a major step forward in open, interoperable AI infrastructure.

Extending AMD leadership in AI and high-performance computing, "Helios" provides the foundation to deliver the open, scalable infrastructure that will power the world's growing AI demands. Designed to meet the demands of gigawatt-scale data centers, the new ORW specification defines an open, double-wide rack optimized for the power, cooling, and serviceability needs of next-generation AI systems. By adopting ORW and OCP standards, "Helios" provides the industry with a unified, standards-based foundation to develop and deploy efficient, high-performance AI infrastructure at scale.