Silicon Box, a global leader in chiplet integration and advanced semiconductor packaging, announced it has shipped 100-million-units from its flagship factory in Singapore's Tampines Wafer Park. The state-of-the-art facility, which began mass production in late 2023, produces advanced panel-level packaging (PLP) exclusively and is the largest of its kind globally in terms of production capacity. Silicon Box's proprietary technology is able to support chiplet integration by addressing challenges in performance, scalability and costs in wafer-level and traditional packaging schemes.

"Achieving breakthrough results in production at high volume is a significant milestone for Silicon Box, as well as for transitioning the industry towards more scalable and low-cost design and manufacturing schemes - such as panel-level packaging and chiplet adoption - especially to meet the growing demand for larger, more powerful devices for future technologies," said Mike Han, Head of Business at Silicon Box.