TSMC announced today that its next-generation N2 node will enter series production before year's end, with a rapid ramp planned through 2026. This is the second 2 nm-class node to achieve high-volume manufacturing, with Intel's 18A node being the first . Last week, Intel confirmed that its Fab 52 is already pushing out 18A wafers in high-volume manufacturing capacity. The TSMC N2 milestone arrives as the manufacturer posted exceptionally strong Q3 financial results , showing that demand for the most advanced chips is moving faster than the industry can add new capacity. Revenue for Q3 was $33.10 billion, reflecting a 40.8% year-on-year gain and a 10.1% quarter-on-quarter increase.

In the third quarter, TSMC processed an astonishing 4.085 million 300 mm wafers, a rise of approximately 22.4% compared to the same period a year earlier, and reported year-over-year revenue growth of nearly 41%, producing roughly $33.1 billion in sales and more than $15 billion in profit for the quarter. Revenue from advanced process families, including all variants of N3, N5, and N7, now accounts for approximately 74% of total sales. By each node, N3 process shipments accounted for 23% of wafer revenue, N5 for 37% and N7 for 14%. The N5 family showed the largest sales increase, reflecting intense demand for AI accelerators and other high-end devices. It is also worth noting that each node carries a different pricing strategy, with newer nodes being significantly more expensive due to the more advanced manufacturing techniques going into it.