Longsys has announced the industry's first integrated-packaging micro SSD (mSSD), featuring a fully chip-level design that eliminates the traditional PCB assembly process. The new mSSD uses wafer-level System-in-Package (SiP) technology to integrate the controller, NAND, power management integrated circuit (PMIC) and passive components into a single package removing nearly 1,000 solder joints found in standard PCB-based SSDs. According to Longsys, this approach boosts reliability, reducing defect rates from ≤1000 DPPM to ≤100 DPPM and improves production efficiency by removing multiple surface-mount (SMT) and reflow steps. Moreover, this helps streamline manufacturing and lowers additional costs by more than 10%, while cutting energy use and carbon emissions.

Despite its compact 20 × 30 × 2.0 mm size and 2.2 g weight, the mSSD delivers full PCIe Gen 4 ×4 performance with sequential read speeds up to 7400 MB/s, writes up to 6500 MB/s, and up to 1000K / 820K IOPS in 4K random workloads. The device is equipped with an aluminium frame, graphene thermal pad and thermal silicone for heat dissipation. The mSSD supports TLC and QLC NAND configurations with capacities from 512 GB up to 4 TB, and includes a modular clip-on heatsink that allows conversion between M.2 2230, 2242, and 2280 form factors. Longsys says the product is now ramping into mass production and has applied for related international patents.