JEDEC nears completion of SOCAMM2 standard for LPDDR5X memory modules

JEDEC has announced it is finalizing JESD328, the new Small Outline Compression Attached Memory Module (SOCAMM2) standard designed for next-generation AI and data center platforms. The standard defines a low-profile, serviceable LPDDR5/5X-based module intended to deliver high bandwidth, low power consumption, and modular scalability for AI servers.

SOCAMM2 targets dense, high-efficiency configurations used in data center AI workloads. It supports data rates up to 9.6 Gb/s per pin, offering the bandwidth required for modern training and inference applications while maintaining lower energy and cooling demands than traditional server memory. The module design introduces Serial Presence Detect (SPD) for identification and telemetry, ensuring compatibility with enterprise-grade reliability requirements.

Source: JEDEC/ARGOSY

According to JEDEC, SOCAMM2 will provide a mechanical outline suited for compact chassis and high-density board layouts, creating a scalable path to larger memory capacities in upcoming AI-focused systems.

Some manufacturers, including NVIDIA, have already begun transitioning their server platforms to SOCAMM2-class designs following early proprietary implementations. Physically they should be similar if not identical. For companies like NVIDIA, this would be a logical and easy upgrade to speeds from 8533 to 9600 MT/s.

According to JEDEC press release, the JESD328 SOCAMM2 specification should be posted soon.

Source: JEDEC