In an era of unprecedented AI innovation and growth, the entire data center ecosystem is transforming toward more energy-efficient infrastructure to support sustainable growth. With memory playing an increasingly critical role in AI systems, low-power memory solutions have become central to this transformation. Micron Technology, Inc. today announced customer sampling of 192 GB SOCAMM2 (small outline compression attached memory modules) to enable broader adoption of low-power memory within AI data centers. SOCAMM2 extends the capabilities of Micron's first-to-market LPDRAM SOCAMM, delivering 50% more capacity in the same compact footprint. The added capacity can significantly reduce time to first token (TTFT) by more than 80% in real-time inference workloads.

The 192 GB SOCAMM2 uses Micron's most advanced 1-gamma DRAM process technology to deliver greater than 20% improvement in power efficiency, further enabling power design optimization of large data center clusters. These savings become quite significant in full-rack AI installations, which can include more than 40 terabytes of CPU-attached low-power DRAM main memory. The modular design of SOCAMM2 improves serviceability and lays the groundwork for future capacity expansion.