In a major leap for the global semiconductor industry, a joint Chinese research team has developed a method that can slash defects in lithography – a critical step in chipmaking – by up to 99 per cent. The researchers achieved unprecedented clarity by using cryo-electron tomography (cryo-ET) to pinpoint, for the first time, the minute sources of common manufacturing flaws. The findings, published in the journal Nature Communications on September 30, by Professor Peng Hailin from Peking...