Samsung has just reported its third quarter 2025 results , and the company has confirmed that its next-generation HBM4 memory samples has been shipped to customers worldwide, with mass production expected in 2026. "HBM3E is currently in mass production and being sold to all related customers, while HBM4 samples are simultaneously being shipped to key clients," notes Samsung, confirming that its memory business is thriving and advanced memory solutions are in great demand. In addition, the company has confirmed that "In 2026, the Foundry Business will focus on providing a stable supply of new 2 nm GAA products and the HBM4 base-die, and beginning operations at the Company's fab in Taylor, Texas in a timely manner."

In an HBM stack, consisting of stacked DRAM dies up to a 12-high, connected with TSVs, there is the possibility of embedding an optional base die with customized logic/accelerator circuitry tailored to a specific need. Companies usually opt for off-the-shelf HBM memory for the standardized pricing model implemented across suppliers like Samsung, Micron, and SK Hynix. However, when ordering quantities so large, like NVIDIA and AMD do, they can request special accommodation features. While this may not be necessarily a compute die that brings TeraFLOPS of power, it will likely be a data processing/logic die that helps route data packets more efficiently, cutting latency and improving performance. Especially during inference, where latency is the most important factor, having a "smarter" HBM could yield sizable, double-digit gains in throughput of tokens.