SK hynix showcased its full-stack AI memory portfolio for enhancing AI and data center infrastructure at the 2025 OCP Global Summit in San Jose, California from October 13-16. The OCP Global Summit is a conference hosted by the Open Compute Project (OCP), the world's largest open data center technology collaboration community. Held under the theme "Leading the Future of AI", this year's event welcomed experts from leading global companies and developers to share the latest trends in data center and AI infrastructure and discuss developing industry solutions.

Under the slogan "MEMORY, Powering AI and Tomorrow," SK hynix presented a range of innovative technologies which improve the performance and efficiency of AI infrastructure. The company's interactive booth was organized into four sections - HBM, AiM, DRAM, and eSSDs - and featured product-based character designs, 3D models of key technologies, and live demonstrations. The centerpiece of SK hynix's booth was its groundbreaking 12-layer HBM4. In September 2025, the company became the first in the world to complete development of HBM4 and establish the product's mass production system. Featuring 2,048 input/output (I/O) channels, twice that of the previous generation, HBM4 offers increased bandwidth and over 40% greater power efficiency. These specifications make it optimized for ultra-high-performance AI computing systems.