Flex, a global manufacturing leader and innovator in data center infrastructure solutions, today announced a new partnership with LG Electronics (LG) to jointly develop integrated, modular cooling solutions that address the escalating thermal management challenges of AI-era data centers. Advanced cooling technologies are required for more efficient heat dissipation in high-density data centers. The partnership brings together Flex's liquid cooling portfolio, proprietary power products, and IT infrastructure solutions with LG's high-performance air and liquid cooling modules, including CRAC, CRAH, chillers, coolant distribution units (CDUs), and full suite of thermal management and monitoring solutions. This gives data center operators the agility to customize solutions and scale with demand.

"Through our collaboration with LG, Flex now offers customers a complete range of cooling solutions to tackle escalating heat challenges in the data center," said Michael Hartung, president and chief commercial officer, Flex. "Together, we'll deliver prefabricated, scalable data center infrastructure solutions that incorporate advanced liquid and air cooling technologies to increase efficiency, simplify deployment, and speed time to revenue for our customers."