Micron has announced a significant revision to the schedule for its semiconductor campus near Clay, New York, with initial production now set to begin at the end of 2030. According to company filings and permit documents, the construction timeline for the first manufacturing facility has been extended from three years to four, and regulators have approved this adjusted schedule. Additionally, Micron has amended its $6.1 billion CHIPS Act agreement to reallocate approximately $1.2 billion from the Clay project to expedite expansion in Boise, Idaho, allowing the Idaho site to become operational well before the New York facility. This is part of Micron's strategy to maintain at least 40% of its DRAM manufacturing operations in the U.S.

The revised schedule significantly delays the following phases of the Clay campus and changes the project's long-term outlook. According to the new plan, the second fab is now set to begin in mid-2030 and is expected to be completed around 2034. Similar delays have affected the third and fourth fabs. As a result, the completion of the entire four-fab campus has been pushed from the original target of 2040 to closer to 2045. This delay also affects the introduction of community support initiatives, such as childcare, housing, and transit improvements, which are intended to benefit the campus workforce. Local officials attribute the slowdown primarily to labor shortages and extended construction cycles.