TrendForce's latest investigations reveal that the rapid expansion of AI and HPC is increasing the need for heterogeneous integration, positioning advanced packaging as a strategic priority. TSMC's CoWoS platform is currently the leading solution in this area. However, as CSPs accelerate their in-house ASIC development to accommodate more complex functions, their packaging size requirements are growing substantially. As a result, some CSPs are contemplating a switch from TSMC's CoWoS to Intel's EMIB.

TrendForce notes that CoWoS connects compute logic, memory, and I/O dies via an interposer, which mounts them on a substrate. The technology has expanded to include CoWoS-S, CoWoS-R, and CoWoS-L. Demand has been strongly shifting toward CoWoS-L, which incorporates a silicon interposer into the package, as NVIDIA's Blackwell platform approaches mass production in 2025. This trend is expected to continue with NVIDIA's upcoming Rubin architecture, which will boast even larger reticle sizes.