Unlucky owners of certain PlayStation 5 standard and Slim have experienced problems with the seeping out of liquid metal thermal interface material (TIM). This issue has occasionally caused unwanted overheating of the popular home console's AMD chipset. In a surprise move, Sony engineers have reportedly fixed this matter—albeit within the latest revisions of hardware. Modyfikator, a Polish YouTuber and PlayStation modder, recently shared their discovery of this "silent" update. A series of past weekend social media posts provided some gory insights. The plucky modification enthusiast has kindly pulled apart brand-new products, and discovered pleasing internal changes: "(the) MOST important hardware update of the year is here! Sony has quietly updated all new PlayStation 5 Slim consoles (model CFI-2116)—both Disc and Digital Editions—with an ALL-NEW cooling system!"

Sony's PlayStation 5 Pro (MSRP: $749.99) received similar treatment earlier in the year, following complaints about factory applications of Liquid Metal TIM becoming unstable beyond original confines. Improved internals were designed around the prevention of leaks/spillages outside the vicinity of a system's APU. Fortunately, this initiative has extended to cheaper SKUs. Modyfikator foresees headache-less gaming sessions on redesigned units: "no more concerns about thermal degradation issues from older revisions. This is the most stable PS5 you can buy right now!" Elaborating on their discovery, Modyfikator provided comparative teardowns of new and old units. A follow-up post stated: "Sony implemented a solution in the Slim that was expected to be a hallmark of the Premium console, the PlayStation Pro—the new version is free from the metal leak issue that affected older PS5 FAT/ OG and Slim CFI2016 from 2023. They optimized the heatsink core for maximum heat dissipation while maintaining full reliability!" Hopefully, the latest iteration of standard PlayStation 5 (non-Slim) features improved internal surfaces and layout.