Samsung has reportedly finished development of its first sixth-generation HBM (HBM4) chips and is now in the final pre-mass-production stage. According to new reporting from AjuNews and Korean industry sources, Samsung's Device Solutions division has cleared Production Readiness Approval (PRA), the last internal checkpoint before full-volume manufacturing. HBM4 is expected to deliver roughly 60% higher bandwidth than the current HBM3E chips. Samsung has already shipped HBM4 samples to NVIDIA, which is evaluating them for use in its upcoming Rubin platform . Initial samples have already exceeded NVIDIA's next-gen GPU requirement of 11 Gbps per pin. The company is using improved 1c-class DRAM paired with a 4 nm logic base die, a combination that helps close the gap with rivals while keeping thermals and power in check at these higher speeds. Once NVIDIA signs off, Samsung can move straight into volume production, with manufacturing lines already prepared.

Samsung had already signaled strong progress during its Q3 2025 earnings call on October 30, noting that HBM4 samples were in the hands of global customers and that mass production is planned for 2026. "HBM3E is currently in mass production and being sold to all related customers, while HBM4 samples are simultaneously being shipped to key clients," the company said at the time. Samsung also confirmed that its foundry arm will prioritize stable 2 nm GAA output and HBM4 base-die production in 2026, alongside the ramp of its new Taylor, Texas fab. The company is also said to be working on a faster HBM4 variant targeting another 40% performance uplift, with an announcement possible as early as mid-February 2026.