A newly leaked NBD shipping manifest reveals that AMD plans to offer its upcoming "Medusa Point" mobile processors in two TDP options—28 W and 45 W—instead of a single configuration. The document mentions FP10-designated parts and separate heatsink entries for high and low TDP variants, indicating that AMD will provide distinct SKUs optimized for either efficiency in laptops and handhelds or sustained performance in mobile workstations. The "Medusa Point" is expected to fit into a slightly larger FP10 socket. However, this APU is scheduled for release in 2027, as 2026 is anticipated to be the year of the "Gorgon Point" generation , which will be a "Strix Halo" refresh with higher CPU clocks.

Architecturally, "Medusa Point" shifts from a single die approach in some segments by combining an N2P compute tile with an N3P I/O tile, while entry-level models will continue to use a cost-effective smaller monolithic N3P die. The CPU core complex is based on "Zen 6," which enhances compute capabilities and introduces new instruction support aimed at improving AVX software compatibility and efficiency . Graphics will continue to use an RDNA 3.5-derived design for the integrated GPU, extending AMD's current non-RDNA 4 roadmap for another product cycle.