MaxSun unveiled the iCraft X870M, a Socket AM5 motherboard in the microATX form-factor that's based on AMD X870 chipset. The board comes with "readiness" for future generation processors, and perhaps the most interesting bit here is support for 300 W CPU power delivery that's "unlockable" to 400 W. Current Ryzen 9000 and Ryzen 7000 series processors come with stock TDP as high as 170 W for the 12-core and 16-core models, with PPT (package power tracking) values that go up to 230 W, which is just above the 225 W design limit of the 8-pin EPS connector, requiring an additional 4-pin or 8-pin EPS input, with most board vendors opting for the latter. MaxSun mentioning 300 W delivery capability that can go up to 400 W is interesting, and could be a hint that motherboard vendors anticipate AMD's next-gen processors to come with higher TDP and PPT values. The VRM solution itself consists of a 16+2+1 phase setup, and uses 50 A DrMOS.

As for the product itself, the MaxSun iCraft X870M is a feature-packed motherboard within its form-factor. Two of the features that stand out are active cooling and a true-color display. The motherboard has a rare combination of three M.2 slots, two on the obverse side of the PCB, and one on the reverse side. One of these is Gen 5 x4, and wired to the processor. This slot, along with an FCH-connected Gen 4 M.2 slot, are cooled under the airflow of a 40 mm fan that also cools the FCH. There is a 4-inch true-color display that can be programmed to show just about anything, such as real-time monitoring stats, or cool animations. The board support DDR5-8400 OC speeds, and supports a wealth of CPU overclocking options, including that 400 W power delivery unlock.