Interesting developments are unfolding in the world of DRAM and NAND flash, as one of the largest players, SK Hynix, has announced product updates for 2026. The company appears to be following its competitor Samsung by slowing the ramp-up of its next-generation HBM4. Initially, SK Hynix planned to increase its HBM4 capacity in the second quarter of 2026. However, this has been postponed to the third quarter of 2026, as the company plans to expand its HBM4 manufacturing capacity. The delay is due to the high demand for its current HBM3E capacity, necessitating the continued operation of HBM3E manufacturing sites longer than expected. SK Hynix's largest customer for HBM chips, NVIDIA, is reportedly facing challenges with the volume production of "Rubin," delaying the need for HBM4, while the HBM3E-equipped "Blackwell" remains in strong demand.