PCBAIR announced the launch of its advanced 8-layer Glass Core PCB manufacturing capabilities, combining proprietary Through Glass Via (TGV) technology with multi-layer redistribution layers (RDL). The new glass substrates achieve superior signal integrity and thermal stability, addressing the critical interconnect density limitations faced by traditional organic substrates in the era of artificial intelligence and high-performance computing (HPC).

Designed for AI accelerators, high-speed data center servers, and optical transceivers, PCBAIR's 8-layer Glass Core PCBs support finer line widths and spacing, with pilot production and customer sampling commencing immediately.