xMEMS Labs, creator of the world's first solid-state MEMS loudspeakers and the first fan-on-a-chip cooling solution, today announced its participation at CES 2026 (January 6-9, Las Vegas, The Venetian, Suite 34-208), where it will demonstrate category-defining innovations for the fast-accelerating market of AI-enabled wearable and mobile devices.

At the show, xMEMS will highlight two flagship piezoMEMS technologies uniquely suited for the new class of all-day-wearable, AI-powered consumer electronics:
µCooling - the world's first air-pump-on-a-chip: a 1-mm-thin, solid-state micro-blower capable of delivering local, targeted airflow to manage heat from AI processors in devices too thin for mechanical fans - such as smart glasses, smartphones, SSDs, and other compact edge-AI systems.