AMD adopts Fire Range mobile chips for EPYC Embedded, up to 10 years of avaibility
AMD has introduced the EPYC Embedded 2005 series, a new family of “Zen 5” based x86 processors aimed at compact, power and thermally constrained designs. The chips target embedded workloads such as network switches and routers, DPU control planes, cold storage systems, aerospace, robotics, and industrial controllers that must run around the clock while staying within tight power and space budgets. All models use a 40 x 40 mm BGA package that integrates compute and I/O for board designs where socketed server CPUs are not practical.
According to AMD, the EPYC Embedded 2005 series can deliver up to 28% higher boost CPU frequency and 35% higher base CPU frequency than a comparable Intel Xeon 6503P-B part, while doing so at half the TDP. The small BGA package is said to be 2.4x smaller than Xeon 6500P-B solutions, with the dense pin-out enabling shorter signal paths and simpler power delivery and cooling.
Source: AMD
Reliability, security, and long-term availability are key selling points. AMD rates EPYC Embedded 2005 processors for up to 10 years of continuous field operation, with a matching 10-year ordering window and 15 years of software maintenance to support long-lived platforms.
On the connectivity side, the series exposes 28 lanes of PCIe Gen5 for add-in cards and accelerators, with up to 16 lanes that can be grouped for high-bandwidth Ethernet NICs, FPGAs, or custom ASICs. A dual-channel DDR5 memory controller supports DDR5-5600 with one DIMM per channel or DDR5-3600 with two DIMMs per channel, including sideband ECC, offering higher bandwidth and a migration path as DDR4-based platforms phase out. AMD also points to an open-source software stack with upstream support for Yocto, Linux kernel drivers, and EDK II firmware to help embedded vendors integrate the chips into existing frameworks.
Source: AMD
The initial EPYC Embedded 2005 lineup consists of three SKUs. The EPYC Embedded 2435 offers 8 cores and 16 threads with a 2.8 GHz base and 4.5 GHz boost clock, 32 MB of L3 cache, and a 45 W TDP. The EPYC Embedded 2655 steps up to 12 cores and 24 threads with 64 MB of L3 cache, a 2.7 GHz base and 4.5 GHz boost, and a 55 W TDP. At the top sits the EPYC Embedded 2875 with 16 cores, 32 threads, 64 MB of L3 cache, a 3.0 GHz base and 4.5 GHz boost clock, and a 75 W TDP. All three share the same FL1 lidless BGA package, PCIe Gen5 and DDR5 support, and are planned to be available for up to a decade.
| AMD EPYC 2005 Specifications | |||
|---|---|---|---|
| Model # | 2435 | 2655 | 2875 |
| OPN | 100-000001912 | 100-000001911 | 100-000001910 |
| Die Configuration | 1 CCD + 1 IOD | 1 CCD + 1 IOD | 2 CCD + 1 IOD |
| “Zen 5” Cores | 8 | 12 | 16 |
| # of Threads | 16 Threads | 24 Threads | 32 Threads |
| L3 Shared Cache | 32 MB | 64 MB | 64 MB |
| Base / Boost Frequency | 2.8 / 4.5 GHz | 2.7 / 4.5 GHz | 3.0 / 4.5 GHz |
| PCIe Gen5 | 28 Lanes | 11 Root Ports | SR-IOV | Enhanced Hot Plug | 28 Lanes | 11 Root Ports | SR-IOV | Enhanced Hot Plug | 28 Lanes | 11 Root Ports | SR-IOV | Enhanced Hot Plug |
| Storage Interface | 4x NVMe | 4x NVMe | 4x NVMe |
| DDR Interface | 2-Channel DDR5-5600 (1 DIMM/Channel) or DDR5-3600 (2 DIMMs/ch) w/sideband ECC | 2-Channel DDR5-5600 (1 DIMM/Channel) or DDR5-3600 (2 DIMMs/ch) w/sideband ECC | 2-Channel DDR5-5600 (1 DIMM/Channel) or DDR5-3600 (2 DIMMs/ch) w/sideband ECC |
| USB | 4x USB 3.2 Gen 2 (10 Gb/s) + 1x USB 2.0 (480 Mb/s) | 4x USB 3.2 Gen 2 (10 Gb/s) + 1x USB 2.0 (480 Mb/s) | 4x USB 3.2 Gen 2 (10 Gb/s) + 1x USB 2.0 (480 Mb/s) |
| SPI | 1x eSPI/SPI Controller + 1x SPI Controller | 1x eSPI/SPI Controller + 1x SPI Controller | 1x eSPI/SPI Controller + 1x SPI Controller |
| I2C / I3C | 4x ports (SMBus: 2x Ports Shared with I2C) | 4x ports (SMBus: 2x Ports Shared with I2C) | 4x ports (SMBus: 2x Ports Shared with I2C) |
| cTDP | 45–55W | 45–75W | 45–75W |
| Nominal TDP | 45W | 55W | 75W |
| Junction Temperature | 0 to 105°C | 0 to 105°C | 0 to 105°C |
| Package | FL1 Lidless BGA: 40 x 40 x 2.133 mm; 0.81 mm pitch, 1,763 ball count | FL1 Lidless BGA: 40 x 40 x 2.133 mm; 0.81 mm pitch, 1,763 ball count | FL1 Lidless BGA: 40 x 40 x 2.133 mm; 0.81 mm pitch, 1,763 ball count |
| Planned Availability | Up to 10 Years | Up to 10 Years | Up to 10 Years |
Source: AMD
