Samsung Foundry's "Heat Path Block" (HPB) technology is reportedly a key aspect featured within the upcoming Exynos 2600 application processor (AP). The South Korean's previous flagship mobile chipsets have often been beset with thermal issues, leading to the deployment of rival chipsets within certain generations of Samsung Galaxy smartphones. The South Korean seems to be pinning its hopes on the emerging Exynos 2600 across a number of fronts. Most notably as a confident "proof of concept" demonstration of the foundry business's cutting-edge 2 nm GAA process (aka SF2). According to a freshly-published ET News SK article, Samsung's innovative "semiconductor heat-suppressing technology" has already attracted interest from Apple and Qualcomm.

In the recent past, these VVIP clients have been on the order books for TSMC's best modern node processes. Samsung's SF2 line is seemingly being dangled as a carrot; designed to entice the return of former customers. Semiconductor industry trackers reckon that the Exynos 2600 SoC—enhanced with HPB tech—will serve as a strong demo of Samsung's 2 nm chip making capabilities. The foundry's in-house Heat Path Block is a copper heatsink that is packaged on top of a mobile AP. Heat dissipation is further maximized by moving DRAM to the side—previous Exynos layouts had this aspect placed atop APs. Insiders believe that a 30% improvement has been observed when comparing the Exynos 2600 to a predecessor. Samsung's System LSI division supposedly co-created the HPB design with an internal packaging development organization.