TSMC is speeding up advanced chip manufacturing in the U.S. According to a report from Nikkei, the company plans to start moving production equipment into its second Arizona fab around mid-2026, with 3 nm chip production targeted for 2027. Sources cited by the report say tool installation is expected to begin between July and September 2026. Once equipment is in place, it typically takes close to a year to qualify production lines and begin volume manufacturing. For advanced nodes like 3 nm, the process can take even longer as modern chip production involves well over 1,000 individual steps and extensive process validation at new sites. This updated timeline lines up with recent comments from TSMC Chairman and CEO C.C. Wei, who has said the company wants to bring U.S. production online earlier than previously planned (originally expected to start production around 2028).

In parallel, Commercial Times reports that TSMC is preparing to invite bids for construction-related contracts at its third Arizona fab by the end of the year. The first TSMC Arizona fab has already started producing chips for Apple, along with NVIDIA's latest Blackwell-based AI processors, according to Nikkei. Once the full $165 billion Arizona project is complete, including five fabs, advanced packaging facilities, and an R&D center, TSMC expects roughly 30% of its most advanced chips to be made in the U.S. Meanwhile, TSMC may adjust plans for its second fab in Kumamoto, Japan . Nikkei reports the company is considering shifting the plant toward 4 nm production instead of the originally planned 6 nm and 7 nm nodes, a move that could require design changes and potentially delay the project.